FPC latest technology trends

With the purpose of diversification and pocket, FPC for high density circuit used in the electronic equipment at the same time, also requires a qualitative sense of high-performance. Figure 5 said the recent FPC circuit density change. Using the reduction method (etching) can form a conductor pitch for single circuit, under 30 LLM conductor pitch under 50 LLM double-sided circuit has practical application. Connection of double-sided circuit or multilayer circuit conductor layer between the conduction aperture is becoming more and more small, now conducting hole size 1 under oobm hole has reached its production scale.

Based on the position of manufacturing technology, figure 6 shows high density circuit can produce range. According to circuit pitch and conduction hole diameter, high density circuit roughly divided into three types: (1) the traditional FPC; (2) high density FPC; (3) high density FPC.

In the traditional reduction method, the pitch diameter 150 gm and conduction TLTL FPC has 15 gm production. Due to the improvement of materials or processing device, even in the subtraction method can processing 30 gm line pitch. In addition, as a result of C0, laser or chemical etching process of import, can achieve 50 um aperture guide hole is production and processing, now most of the high density FPC production is using the technology of processing.